TClamp3302N
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Two
High-Speed Data Lines
These devices are designed to protect two high-speed
data lines (one differential pair) from transient over-
voltages which result from lightning and ESD. They can
be configured to protect in differential (Line-to-Line)
and common (Line-to-Ground) mode. Data line inputs/
outputs are connected at pins 1, 2 and 3, and 8, 9
and 10 as shown. For proper operation, pins 1 - 3
must be connected together and pins 8 - 10 must be
connected together. Pins 4, 5, 6, and 7 may be left
unconnected. For differential operation, the center tab is
also left not connected. For common mode operation,
the center tab is connected to ground. The ground
connection should be made directly to a ground plane
on the board for best results. The use of multiple vias
is recommended for reduced ground loop inductance.
Short-Haul/Intrabuilding Immunity Requirements for
Ethernet-based Systems
Circuit Diagram
LINE 1
(1, 2, 3)
Center Tab
LINE 2
(8, 9, 10)
Pin Configuration (Top Side View)
The accelerating demand for bandwidth-hungry
services such as Voice over IP, Metropolitan Area
Networks (MAN), Ethernet over telecommunications
backplanes, and broadband to the home are driving
the deployment of high-reliability carrier and enterprise
class Ethernet-based systems. These systems require
1
2
3
4
5
GND
10
9
8
7
6
the robust protection of external ports from transient
voltage events such as lightning, electrostatic
discharge, and cable discharge events. Each new
generation of Ethernet deployment yields higher-
density boards that demand protection solutions that
occupy less board space.
The Telcordia Technologies (Bellcore) GR-1089-CORE
specification defines a set of requirements for lightning
and AC power cross immunity for intrabuilding equip-
ment. The lightning tests are applied as metallic (line-
to-line) or longitudinal (line-to-ground) waveforms. The
waveforms are defined with a rise time of 2μs and a
decay time of 10μs with a short circuit current of
100A. One surge of positive and one of negative
polarity are applied. To pass the test, the equipment
must continue to operate after the test. If a 2/10μs
generator is unavailable, then a 8/20μs waveform may
be applied with additional series resistance (6 ? metal-
lic, 12 ? longitudinal).
? 2008 Semtech Corp.
5
P i n
1 , 2 , 3
8 , 9 , 1 0
4 , 5 , 6 , 7
C e n t e r T a b
I d e n t i f i c a t i o n
L i n e 1 i n / o u t
L i n e 2 i n / o u t
N o C o n n e c t
G r o u n d
www.semtech.com
相关PDF资料
TCME226M035R0025 CAP TANT 22UF 35V 20% 2917
TDC685K035NSF-F CAP TANT 6.8UF 35V 10% RADIAL
TDK4453302DH SCR PHASE CTRL 4500V 3300A
TDL106M010S1B-F CAP TANT 10UF 10V 20% RADIAL
TE600 UPS 600VA 425W 6OUT TOWER
TF202P32K7680 CRYSTAL 32.768 KHZ 12.5PF SMD
TF322P32K7680 CRYSTAL 32.768 KHZ 12.5PF SMD
TH23 MOUNTING CLIP HORIZ 1.0IN DIA
相关代理商/技术参数
TCLC7701ID 制造商:TI 制造商全称:Texas Instruments 功能描述:Micropower Supply Voltage Supervisors
TCLC7701IP 制造商:TI 制造商全称:Texas Instruments 功能描述:Micropower Supply Voltage Supervisors
TCLC7701IPWR 制造商:TI 制造商全称:Texas Instruments 功能描述:Micropower Supply Voltage Supervisors
TCLD1000 功能描述:晶体管输出光电耦合器 Photodarlington Out Single CTR >600% RoHS:否 制造商:Vishay Semiconductors 输入类型:DC 最大集电极/发射极电压:70 V 最大集电极/发射极饱和电压:0.4 V 绝缘电压:5300 Vrms 电流传递比:100 % to 200 % 最大正向二极管电压:1.65 V 最大输入二极管电流:60 mA 最大集电极电流:100 mA 最大功率耗散:100 mW 最大工作温度:+ 110 C 最小工作温度:- 55 C 封装 / 箱体:DIP-4 封装:Bulk
TCLD1000_08 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:Optocoupler, Photodarlington Output, SOP-4L, Long Mini-Flat Package
TCLK365 制造商:General Electric Company 功能描述:SG600 FRAME LUG KIT: 3-POLE
TCLK65 制造商: 功能描述:
TCLL4148 制造商:TAK_CHEONG 制造商全称:Tak Cheong Electronics (Holdings) Co.,Ltd 功能描述:500 mW LL-34 Hermetically Sealed Glass Fast Switching Diodes